2016 ENGINI Humidity sensing/mm-scale wireless (CBIT16E01_ENGINI)
N/A
chip_id: CBIT16E01_ENGINI
Test structures for mm-scale implantable neural interfaces. Includes test humidity sensors, coils for wireless coupling, and seal rings for micropackaging.
- Related projects: ENGINI
Technology: AMS 0.35μm 2P4M CMOS (H35B4S1)
Silicon Area: 7mm × 4mm
Designers: Federico Mazza, Peilong Feng, Katarzyna M. Szostak, Timothy G. Constandinou
Tape-out: May 2016
Relevant Publications
- P. Feng, P. Yeon, Y. Cheng, M. Ghovanloo and T. G. Constandinou, "Chip-Scale Coils for Millimeter-Sized Bio-Implants," in IEEE Transactions on Biomedical Circuits and Systems, vol. 12, no. 5, pp. 1088-1099, Oct. 2018.